Semiconductor package and method of forming the same

ABSTRACT

An embodiment is a method including forming a first passive device in a first wafer, forming a first dielectric layer over a first side of the first wafer, forming a first plurality of bond pads in the first dielectric layer, planarizing the first dielectric layer and the first plurality of bond pads to level top surfaces of the first dielectric layer and the first plurality of bond pads with each other, hybrid bonding a first device die to the first dielectric layer and at least some of the first plurality of bond pads, and encapsulating the first device die in a first encapsulant.

PRIORITY CLAIM AND CROSS-REFERENCE

This application is a continuation of U.S. patent application Ser. No.16/036,664, filed Jul. 16, 2018, (now U.S. Pat. No. 10,522,490, issuedDec. 21, 2019), which is a continuation of U.S. patent application Ser.No. 15/707,700, filed Sep. 18, 2017, (now U.S. Pat. No. 10,026,704,issued Jul. 17, 2018), which is a continuation of U.S. patentapplication Ser. No. 15/272,491, filed Sep. 22, 2016, (now U.S. Pat. No.9,768,133, issued on Sep. 19, 2017), which applications are herebyincorporated herein by reference.

BACKGROUND

The semiconductor industry has experienced rapid growth due to ongoingimprovements in the integration density of a variety of electroniccomponents (e.g., transistors, diodes, resistors, capacitors, etc.). Forthe most part, improvement in integration density has resulted fromiterative reduction of minimum feature size, which allows morecomponents to be integrated into a given area. As the demand forshrinking electronic devices has grown, a need for smaller and morecreative packaging techniques of semiconductor dies has emerged. Anexample of such packaging systems is Package-on-Package (PoP)technology. In a PoP device, a top semiconductor package is stacked ontop of a bottom semiconductor package to provide a high level ofintegration and component density. PoP technology generally enablesproduction of semiconductor devices with enhanced functionalities andsmall footprints on a printed circuit board (PCB).

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1 through 13 illustrate cross-sectional views of intermediatesteps during a process for forming a package structure in accordancewith some embodiments.

FIG. 14 illustrates a cross-sectional view of a package structureincluding openings through a wafer in accordance with some embodiments.

FIG. 15 illustrates a cross-sectional view of a package structureincluding a single integrated circuit die in accordance with someembodiments.

FIGS. 16 through 23 illustrate cross-sectional views of intermediatesteps during a process for forming a package structure in accordancewith some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Embodiments discussed herein may be discussed in a specific context,namely a package structure and methods of forming the package structureincluding an integrated fan-out design that enables more functionalityand reliability. The package structures may include a chip/die that ishybrid bonded to a wafer structure with the wafer structure includingone or more integrated passive devices (IPDs). Some of disclosed methodsof forming the package structure include optimization of the method thatdoes not require as many carrier substrates as other methods. Further,the hybrid bonding process allows for the bond between the chip/die andthe wafer to not include a solder material, and thus, may increase thereliability and yield of package structures.

Further, the teachings of this disclosure are applicable to any packagestructure including an integrated chip/die and/or integrated passivedevices. Other embodiments contemplate other applications, such asdifferent package types or different configurations that would bereadily apparent to a person of ordinary skill in the art upon readingthis disclosure. It should be noted that embodiments discussed hereinmay not necessarily illustrate every component or feature that may bepresent in a structure. For example, multiples of a component may beomitted from a figure, such as when discussion of one of the componentmay be sufficient to convey aspects of the embodiment. Further, methodembodiments discussed herein may be discussed as being performed in aparticular order; however, other method embodiments may be performed inany logical order.

FIGS. 1 through 13 illustrate cross-sectional views of intermediatesteps during a process for forming a package structure in accordancewith some embodiments. In FIG. 1, a wafer 20 is illustrated including asubstrate 22, through vias 24, and passive devices 26. The substrate 22may be a semiconductor substrate, such as a bulk semiconductor, asemiconductor-on-insulator (SOI) substrate, or the like, which may bedoped (e.g., with a p-type or an n-type dopant) or undoped. Thesubstrate 22 may be a wafer, such as a silicon wafer. Generally, an SOIsubstrate comprises a layer of a semiconductor material formed on aninsulator layer. The insulator layer may be, for example, a buried oxide(BOX) layer, a silicon oxide layer, or the like. The insulator layer isprovided on a substrate, typically a silicon or glass substrate. Othersubstrates, such as a multi-layered or gradient substrate may also beused. In some embodiments, the semiconductor material of the substrate22 may include silicon; germanium; a compound semiconductor includingsilicon carbide, gallium arsenic, gallium phosphide, indium phosphide,indium arsenide, and/or indium antimonide; an alloy semiconductorincluding SiGe, GaAsP, AlInAs, AlGaAs, GaInAs, GaInP, and/or GaInAsP; orcombinations thereof.

In some embodiments, the substrate 22 may include active devices (notshown) in addition to the passive devices 26. The active devices maycomprise a wide variety of active devices such as transistors and thelike that may be used to generate the desired structural and functionalparts of the design. The active devices may be formed using any suitablemethods either within or else on the substrate 22.

The through vias 24 of the wafer 20 may be formed, for example, byetching openings into the substrate 22 and then depositing a conductivematerial into the openings. These openings for the through vias 24 mayall be formed simultaneously in a same process, or in separateprocesses. Openings into the substrate 22 may be formed using a suitablephotolithographic mask and etching process. For example, a photoresistmay be formed and patterned over the substrate 22, and one or moreetching processes (e.g., a wet etch process or a dry etch process) areutilized to remove those portions of the substrate 22 where the throughvias 24 are desired.

Once the openings for the through vias 24 have been formed, the openingsfor the through vias 24 may be filled with, e.g., a liner, such as adiffusion barrier layer, an adhesion layer, or the like, and aconductive material. The liner may include titanium, titanium nitride,tantalum, tantalum nitride, or the like. The liner may be formed using achemical vapor deposition (CVD) process, such as a plasma enhanced CVD(PECVD). However, other alternative processes, such as sputtering ormetal organic chemical vapor deposition (MOCVD), may be used.

The conductive material of the through vias 24 may comprise one or moreconductive materials, copper, a copper alloy, silver, gold, tungsten,aluminum, nickel, other conductive metals, or the like. The conductivematerial may be formed, for example, by depositing a seed layer (notshown) and using electroplating, electroless plating, or the like todeposit conductive material onto the seed layer, filling and overfillingthe openings for the through vias 24. Once the openings for the throughvias 24 have been filled, excess liner and excess conductive materialoutside of the openings for the through vias 24 may be removed through agrinding process such as chemical mechanical polishing (CMP), althoughany suitable removal process may be used. As one of ordinary skill inthe art will recognize, the above described process for forming thethrough vias 24 is merely one method of forming the through vias 24, andother methods are also fully intended to be included within the scope ofthe embodiments. The through vias 24 may not extend through thesubstrate 22 at this point in processing and at a later point inprocessing the substrate may be thinned to expose the through vias 24through the substrate 22 (see FIG. 11).

The passive devices 26 may be referred to as integrated passive devices(IPDs) 26. In some embodiments, the IPDs 26 may be formed by the sameprocesses and at the same time as the through vias 24. The IPDs 26 maycomprise a wide variety of passive devices such as capacitors,resistors, inductors, the like, or a combination thereof.

The IPDs 26 may be formed using any suitable methods either within orelse on the first substrate 101. For example, a deep-trench capacitormay be formed by first forming trenches into the substrate 22. Thetrenches may be formed by any suitable photolithographic mask andetching process. For example, a photoresist may be formed and patternedover the substrate 22, and one or more etching processes (e.g., a dryetch process) may be utilized to remove those portions of the substrate22 where the deep-trench capacitors are desired. A first capacitorelectrode may be formed by forming a first conductive electrode materialinto a trench, such as through a deposition process or another process.The first conductive electrode material may be a conductive materialsuch as doped silicon, polysilicon, copper, tungsten, an aluminum orcopper alloy, or another conductive material. A dielectric layer may beformed over the first conductive electrode material within the trench.The dielectric layer may comprise high-K dielectric materials, an oxide,a nitride, or the like, or combinations or multiple layers thereof, andbe formed using any suitable deposition process, such as a CVD process.A second conductive electrode material may be formed over the dielectriclayer in the trench to form a second capacitor electrode, such asthrough a deposition process or another process. The second conductiveelectrode material may be a conductive material such as doped silicon,polysilicon, copper, tungsten, an aluminum or copper alloy, or anotherconductive material. As one of ordinary skill in the art will recognize,the above described process for forming deep-trench capacitors is merelyone method of forming the deep-trench capacitors, and other methods arealso fully intended to be included within the scope of the embodiments.

In FIGS. 2 and 3, a front-side redistribution structure 28 is formedover the wafer 20, the through vias 24, and the IPDs 26. The front-sideredistribution structure 28 includes dielectric layers 32 and 38,metallization patterns 30, and bond pads 36. In some embodiments, theformation of the redistribution structure 28 begins with the formationof metallization patterns 30 over the wafer 20 followed by dielectriclayers 32 and more metallization patterns 30. In other embodiments, adielectric layer 32 is first formed over the wafer 20 followed bymetallization pattern 30 and more dielectric layers 32. In someembodiments, some of the metallization patterns 30 may contact thethrough vias 24. In some embodiments, some of metallization patterns 30may contact portions of the IPDs 26.

As an example to form metallization patterns 30, a seed layer (notshown) is formed over the wafer 20. In some embodiments, the seed layeris a metal layer, which may be a single layer or a composite layercomprising a plurality of sub-layers formed of different materials. Insome embodiments, the seed layer comprises a titanium layer and a copperlayer over the titanium layer. The seed layer may be formed using, forexample, PVD or the like. A photo resist is then formed and patterned onthe seed layer. The photo resist may be formed by spin coating or thelike and may be exposed to light for patterning. The pattern of thephoto resist corresponds to the metallization patterns 30. Thepatterning forms openings through the photo resist to expose the seedlayer. A conductive material is formed in the openings of the photoresist and on the exposed portions of the seed layer. The conductivematerial may be formed by plating, such as electroplating or electrolessplating, or the like. The conductive material may comprise a metal, likecopper, titanium, tungsten, aluminum, or the like. Then, the photoresist and portions of the seed layer on which the conductive materialis not formed are removed. The photo resist may be removed by anacceptable ashing or stripping process, such as using an oxygen plasmaor the like. Once the photo resist is removed, exposed portions of theseed layer are removed, such as by using an acceptable etching process,such as by wet or dry etching. The remaining portions of the seed layerand conductive material form the metallization patterns 30.

One of the dielectric layers 32 are metallization patterns 30. In someembodiments, the dielectric layers 32 and 38 are formed of a polymer,which may be a photo-sensitive material such as polybenzoxazole (PBO),polyimide, benzocyclobutene (BCB), or the like, that may be patternedusing a lithography mask. In other embodiments, the dielectric layers 32and 38 are formed of a nitride such as silicon nitride; an oxide such assilicon oxide, phosphosilicate glass (PSG), borosilicate glass (BSG),boron-doped phosphosilicate glass (BPSG); or the like. The dielectriclayers 32 may be formed by spin coating, lamination, CVD, the like, or acombination thereof.

The dielectric layer 32 is then patterned. The patterning forms openingsto expose portions of the underlying metallization patterns. Thepatterning may be by an acceptable process, such as by exposing thedielectric layer 132 to light when the dielectric layer 132 is aphoto-sensitive material or by etching using, for example, ananisotropic etch. If the dielectric layer 32 is a photo-sensitivematerial, the dielectric layer 32 can be developed after the exposure.

The formation of metallization patterns 30 and dielectric layers 32 canthen be repeated to form the redistribution structure 28 with theappropriate number of layers. After the appropriate number of layers 30and 32 are formed, topmost metallization patterns 36, which includesbond pads 36, are formed over the layers 32 and 30 and in electricalcontact with at least some of the metallization patterns 30.

As an example to form topmost metallization patterns 36, including bondpads 36, a seed layer (not shown) is formed over the topmost layer 32.In some embodiments, the seed layer is a metal layer, which may be asingle layer or a composite layer comprising a plurality of sub-layersformed of different materials. In some embodiments, the seed layercomprises a titanium layer and a copper layer over the titanium layer.The seed layer may be formed using, for example, PVD or the like. Aphoto resist is then formed and patterned on the seed layer. The photoresist may be formed by spin coating or the like and may be exposed tolight for patterning. The pattern of the photo resist corresponds to themetallization patterns 36. The patterning forms openings through thephoto resist to expose the seed layer. A conductive material is formedin the openings of the photo resist and on the exposed portions of theseed layer. The conductive material may be formed by plating, such aselectroplating or electroless plating, or the like. The conductivematerial may comprise a metal, like copper, titanium, tungsten,aluminum, or the like. Then, the photo resist and portions of the seedlayer on which the conductive material is not formed are removed. Thephoto resist may be removed by an acceptable ashing or strippingprocess, such as using an oxygen plasma or the like. Once the photoresist is removed, exposed portions of the seed layer are removed, suchas by using an acceptable etching process, such as by wet or dryetching. The remaining portions of the seed layer and conductivematerial form the metallization patterns 36, including the bond pads 36.Some of the metallization patterns 36 will be used to form through vias40 on (see FIG. 4) and are not considered to be bond pads 36.

In some embodiments, the topmost dielectric layer 38 is formed to coverthe bond pads 36. In these embodiments, a planarization step, such as agrinding or CMP, is performed to remove excess portions of the topmostdielectric layer 38 and provide coplanar surfaces for the bond pads 36and topmost dielectric layer 38.

In other embodiments, the redistribution structure 28 is formed in adual damascene process, which includes depositing dielectric layers 32and 38 (which may be formed as single layers or two layers separated byan etch stop layer), forming trenches in and via openings in thedielectric layers to expose some portions of the metallization patterns30, and filling the trenches and via openings with a conductive materialto form more metallization patterns 30 and/or bond pads 36. A CMP isthen performed to remove excess conductive material. Accordingly, theportions of the conductive material filling the trenches in thedielectric layers 32 and 38 become the metallization patterns 30 andbond pads 36, respectively, while the portions of the conductivematerial filling the via openings become vias.

In FIG. 4, through vias 40 are formed over the redistribution structure28. As an example to form the through vias 40, a seed layer is formedover the redistribution structure 28, e.g., the dielectric layer 38 andthe exposed portions of the metallization pattern 36 as illustrated. Insome embodiments, the seed layer is a metal layer, which may be a singlelayer or a composite layer comprising a plurality of sub-layers formedof different materials. In some embodiments, the seed layer comprises atitanium layer and a copper layer over the titanium layer. The seedlayer may be formed using, for example, PVD or the like. A photo resistis formed and patterned on the seed layer. The photo resist may beformed by spin coating or the like and may be exposed to light forpatterning. The pattern of the photo resist corresponds to through vias.The patterning forms openings through the photo resist to expose theseed layer. A conductive material is formed in the openings of the photoresist and on the exposed portions of the seed layer. The conductivematerial may be formed by plating, such as electroplating or electrolessplating, or the like. The conductive material may comprise a metal, likecopper, titanium, tungsten, aluminum, or the like. The photo resist andportions of the seed layer on which the conductive material is notformed are removed. The photo resist may be removed by an acceptableashing or stripping process, such as using an oxygen plasma or the like.Once the photo resist is removed, exposed portions of the seed layer areremoved, such as by using an acceptable etching process, such as by wetor dry etching. The remaining portions of the seed layer and conductivematerial form through vias 40.

In FIG. 5, integrated circuit dies 42 are bonded to dielectric layer 38and the bond pads 36 of the redistribution structure 28. The integratedcircuit dies 42 may be logic dies (e.g., central processing unit,microcontroller, etc.), memory dies (e.g., dynamic random access memory(DRAM) die, static random access memory (SRAM) die, etc.), powermanagement dies (e.g., power management integrated circuit (PMIC) die),radio frequency (RF) dies, sensor dies, micro-electro-mechanical-system(MEMS) dies, signal processing dies (e.g., digital signal processing(DSP) die), front-end dies (e.g., analog front-end (AFE) dies), thelike, or a combination thereof. Also, in some embodiments, theintegrated circuit dies 42 may be different sizes (e.g., differentheights and/or surface areas), and in other embodiments, the integratedcircuit dies 42 may be the same size (e.g., same heights and/or surfaceareas).

Before being bonded to the redistribution structure 28, the integratedcircuit dies 42 may be processed according to applicable manufacturingprocesses to form integrated circuits in the integrated circuit dies 42.For example, the integrated circuit dies 42 each include a semiconductorsubstrate 43, such as silicon, doped or undoped, or an active layer of asemiconductor-on-insulator (SOI) substrate. The semiconductor substrate43 may include other semiconductor material, such as germanium; acompound semiconductor including silicon carbide, gallium arsenic,gallium phosphide, indium phosphide, indium arsenide, and/or indiumantimonide; an alloy semiconductor including SiGe, GaAsP, AlInAs,AlGaAs, GaInAs, GaInP, and/or GaInAsP; or combinations thereof. Othersubstrates, such as multi-layered or gradient substrates, may also beused. Devices, such as transistors, diodes, capacitors, resistors, etc.,may be formed in and/or on the semiconductor substrate 43 and may beinterconnected by interconnect structures 44 formed by, for example,metallization patterns in one or more dielectric layers on thesemiconductor substrate 43 to form an integrated circuit.

The integrated circuit dies 42 further comprise pads (not shown), suchas aluminum pads, on the interconnect structures 44 to which externalconnections are made. The pads are on what may be referred to asrespective active sides of the integrated circuit dies 42. Dieconnectors 46 (may be referred to as bond pads 46), such as conductivepillars (for example, comprising a metal such as copper), aremechanically and electrically coupled to the respective pads. The dieconnectors 46 may be formed by, for example, plating, or the like. Thedie connectors 46 electrically couple the respective integrated circuitsof the integrate circuit dies 42. The integrated circuit dies 42 may besingulated, such as by sawing or dicing, and placed on to the dielectriclayer 108 by using, for example, a pick-and-place tool.

A dielectric material 48 is on the active sides of the integratedcircuit dies 42, such as on the die connectors 46. The dielectricmaterial 48 laterally encapsulates the die connectors 46, and thedielectric material 48 is laterally coterminous with the respectiveintegrated circuit dies 42. The dielectric material 48 may be a polymersuch as PBO, polyimide, BCB, or the like; a nitride such as siliconnitride or the like; an oxide such as silicon oxide, PSG, BSG, BPSG, orthe like; the like, or a combination thereof, and may be formed, forexample, by spin coating, lamination, CVD, or the like.

The integrated circuit dies 42 are bonded to the dielectric layer 38 andthe bond pads 36 through hybrid bonding. To achieve the hybrid bonding,the integrated circuit dies 42 are first pre-bonded to the dielectriclayer 38 and the bond pads 36 by lightly pressing the integrated circuitdies 42 against the dielectric layer 38 and the bond pads 36. Althoughfour integrated circuit dies 42 are illustrated, the hybrid bonding maybe performed at wafer level, wherein a plurality of integrated circuitdies identical to the illustrated integrated circuit dies 42 arepre-bonded, and arranged as rows and columns.

After all of the integrated circuit dies 42 are pre-bonded, an annealingis performed to cause the inter-diffusion of the metals in the bond pads36 and the die bond pads 46. In accordance with some embodiments of thepresent disclosure, one or both of dielectric layers 38 and 48 comprisea polymer. Accordingly, the annealing temperature is lowered to lowerthan about 250° C. in order to avoid the damage of the polymer. Forexample, the annealing temperature (with the presence of polymer) may bein the range between about 200° and about 250° C. The annealing time maybe between about 2 hours and 3 hours. When both dielectric layers 38 and48 are formed of inorganic dielectric materials such as oxide oroxynitride, the annealing temperature may be higher, which is lower thanabout 400° C. For example, the annealing temperature (without thepresence of polymer) may be in the range between about 300° and about400° C., and the annealing time may be in the range between about 1.5hours and about 2.5 hours.

Through the hybrid bonding, the bond pads 36 and 46 are bonded to eachother through direct metal bonding caused by metal inter-diffusion. Thebond pads 36 and 46 may have distinguishable interfaces. The dielectriclayer 38 is also bonded to the dielectric layer 48, with bonds formedtherebetween. For example, the atoms (such as oxygen atoms) in one ofthe dielectric layers 38 and 48 form chemical or covalent bonds (such asO—H bonds) with the atoms (such as hydrogen atoms) in the other one ofthe dielectric layers 38 and 48. The resulting bonds between thedielectric layers 38 and 48 are dielectric-to-dielectric bonds, whichmay be inorganic-to-polymer, polymer-to-polymer, orinorganic-to-inorganic bonds in accordance with various embodiments.Furthermore, the surface dielectric layers 48 of two integrated circuitdies 42 may be different from each other (for example, with one being apolymer layer and the other being an inorganic layer), and hence theremay be two types of inorganic-to-polymer, polymer-to-polymer, andinorganic-to-inorganic bonds existing simultaneously in the samepackage.

In FIGS. 6 and 7, an encapsulant 58 is formed on the various components.The encapsulant 58 may be a molding compound, epoxy, or the like, andmay be applied by compression molding, transfer molding, or the like.The top surface of encapsulant 58 is higher than the top ends of throughvias 40 and the backside surface of the integrated circuit dies 42. Theencapsulant 58 is then cured. In accordance with other embodiments,encapsulant 58 can be formed of an inorganic dielectric materialincluding an oxide (such as silicon oxide or silicon oxynitride) or anitride (such as silicon nitride). The formation methods of theencapsulant 58 in accordance with these embodiments may include CVD.

In FIG. 8, a planarization such as a CMP step or a grinding step isperformed to thin the encapsulant 58 until through vias 40 (if any) areexposed. Top surfaces of the through vias 40 and the encapsulant 58 arecoplanar after the planarization process. In some embodiments, theplanarization process may be omitted, for example, if through vias 40are already exposed through the encapsulant 58. Although not shown, insome embodiments, the planarization process may expose backside surfacesof the integrated circuit dies 42.

In FIG. 9, a backside redistribution structure 60 is formed. As will beillustrated in FIG. 9, the backside redistribution structure 60 includesone or more dielectric layers 62 and metallization patterns 64. A firstdielectric layer 62 is deposited on the encapsulant 58 and the throughvias 40. In some embodiments, the dielectric layer 62 is formed of apolymer, which may be a photo-sensitive material such as PBO, polyimide,BCB, or the like, that may be patterned using a lithography mask. Inother embodiments, the dielectric layer 62 is formed of a nitride suchas silicon nitride; an oxide such as silicon oxide, PSG, BSG, BPSG; orthe like. The dielectric layer 62 may be formed by spin coating,lamination, CVD, the like, or a combination thereof.

Next, the first dielectric layer 62 is then patterned. The patterningforms openings to expose portions of the through vias 40. The patterningmay be by an acceptable process, such as by exposing the dielectriclayer 62 to light when the dielectric layer 62 is a photo-sensitivematerial or by etching using, for example, an anisotropic etch. If thedielectric layer 62 is a photo-sensitive material, the dielectric layer62 can be developed after the exposure.

Next, metallization pattern 64 with vias is formed on the firstdielectric layer 62. As an example to form metallization pattern 64, aseed layer (not shown) is formed over the first dielectric layer 62 andin openings through the first dielectric layer 62. In some embodiments,the seed layer is a metal layer, which may be a single layer or acomposite layer comprising a plurality of sub-layers formed of differentmaterials. In some embodiments, the seed layer comprises a titaniumlayer and a copper layer over the titanium layer. The seed layer may beformed using, for example, PVD or the like. A photo resist is thenformed and patterned on the seed layer. The photo resist may be formedby spin coating or the like and may be exposed to light for patterning.The pattern of the photo resist corresponds to the metallization pattern64. The patterning forms openings through the photo resist to expose theseed layer. A conductive material is formed in the openings of the photoresist and on the exposed portions of the seed layer. The conductivematerial may be formed by plating, such as electroplating or electrolessplating, or the like. The conductive material may comprise a metal, likecopper, titanium, tungsten, aluminum, or the like. Then, the photoresist and portions of the seed layer on which the conductive materialis not formed are removed. The photo resist may be removed by anacceptable ashing or stripping process, such as using an oxygen plasmaor the like. Once the photo resist is removed, exposed portions of theseed layer are removed, such as by using an acceptable etching process,such as by wet or dry etching. The remaining portions of the seed layerand conductive material form the metallization pattern 64 and vias. Thevias are formed in openings through the first dielectric layer 62 to,e.g., the through vias 40.

Next, a second dielectric layer 62 is deposited on the metallizationpattern 64 and the first dielectric layer 62. In some embodiments, thesecond dielectric layer 62 is formed of a polymer, which may be aphoto-sensitive material such as PBO, polyimide, BCB, or the like, thatmay be patterned using a lithography mask. In other embodiments, thesecond dielectric layer 62 is formed of a nitride such as siliconnitride; an oxide such as silicon oxide, PSG, BSG, BPSG; or the like.The second dielectric layer 62 may be formed by spin coating,lamination, CVD, the like, or a combination thereof.

The second dielectric layer 62 is then patterned. The patterning formsopenings to expose portions of the metallization pattern 64. Thepatterning may be by an acceptable process, such as by exposing thedielectric layer 140 to light when the dielectric layer is aphoto-sensitive material or by etching using, for example, ananisotropic etch. If the second dielectric layer 62 is a photo-sensitivematerial, the second dielectric layer 62 can be developed after theexposure.

The back-side redistribution structure 60 is shown as an example. Moreor fewer dielectric layers and metallization patterns may be formed inthe back-side redistribution structure 60. If fewer dielectric layersand metallization patterns are to be formed, steps and process discussedabove may be omitted. If more dielectric layers and metallizationpatterns are to be formed, steps and processes discussed above may berepeated. One having ordinary skill in the art will readily understandwhich steps and processes would be omitted or repeated.

The structure illustrated in FIG. 9 may be referred to as one or morefirst packages 100, which, in some embodiments, may be singulated at alater time in processing.

In FIG. 10, one or more second packages 110 are bonded to the one ormore first packages 100 of FIG. 9. Each of the second packages 110includes a substrate 70 and one or more dies 74 coupled to the substrate70. The substrate 70 may be made of a semiconductor material such assilicon, germanium, diamond, or the like. In some embodiments, compoundmaterials such as silicon germanium, silicon carbide, gallium arsenic,indium arsenide, indium phosphide, silicon germanium carbide, galliumarsenic phosphide, gallium indium phosphide, combinations of these, andthe like, may also be used. Additionally, the substrate 70 may be asilicon-on-insulator (SOI) substrate. Generally, an SOI substrateincludes a layer of a semiconductor material such as epitaxial silicon,germanium, silicon germanium, SOI, silicon germanium on insulator(SGOI), or combinations thereof. The substrate 70 is, in one alternativeembodiment, based on an insulating core such as a fiberglass reinforcedresin core. One example core material is fiberglass resin such as FR4.Alternatives for the core material include bismaleimide-triazine (BT)resin, or alternatively, other printed circuit board (PCB) materials orfilms. Build up films such as Ajinomoto build-up film (ABF) or otherlaminates may be used for substrate 70.

The substrate 70 may include active and passive devices (not shown). Asone of ordinary skill in the art will recognize, a wide variety ofdevices such as transistors, capacitors, resistors, combinations ofthese, and the like may be used to generate the structural andfunctional requirements of the design for the package. The devices maybe formed using any suitable methods.

The substrate 70 may also include metallization layers 72 and throughvias (not shown). The metallization layers 72 may be formed over theactive and passive devices and are designed to connect the variousdevices to form functional circuitry. The metallization layers may beformed of alternating layers of dielectric (e.g., low-k dielectricmaterial) and conductive material (e.g., copper) with viasinterconnecting the layers of conductive material and may be formedthrough any suitable process (such as deposition, damascene, dualdamascene, or the like). In some embodiments, the substrate 70 issubstantially free of active and passive devices.

The substrate 70 may have bond pads (not shown) on a first side thesubstrate 70 to couple to the dies 74, and bond pads 71 on a second sideof the substrate 70, the second side being opposite the first side ofthe substrate 70, to couple to the conductive connectors 78. In someembodiments, the bond pads are formed by forming recesses (not shown)into dielectric layers (not shown) on the first and second sides of thesubstrate 70. The recesses may be formed to allow the bond pads to beembedded into the dielectric layers. In other embodiments, the recessesare omitted as the bond pads may be formed on the dielectric layer. Insome embodiments, the bond pads include a thin seed layer (not shown)made of copper, titanium, nickel, gold, palladium, the like, or acombination thereof. The conductive material of the bond pads may bedeposited over the thin seed layer. The conductive material may beformed by an electro-chemical plating process, an electroless platingprocess, CVD, ALD, PVD, the like, or a combination thereof. In anembodiment, the conductive material of the bond pads 303 and 304 iscopper, tungsten, aluminum, silver, gold, the like, or a combinationthereof.

In an embodiment, the bond pads are UBMs that include three layers ofconductive materials, such as a layer of titanium, a layer of copper,and a layer of nickel. However, one of ordinary skill in the art willrecognize that there are many suitable arrangements of materials andlayers, such as an arrangement of chrome/chrome-copperalloy/copper/gold, an arrangement of titanium/titanium tungsten/copper,or an arrangement of copper/nickel/gold, that are suitable for theformation of the UBMs. Any suitable materials or layers of material thatmay be used for the UBMs are fully intended to be included within thescope of the current application. In some embodiments, the through viasextend through the substrate 70 and couple at least one bond pad one thefirst side of the substrate 70 to at least one bond pad 71 on the secondside of the substrate.

The dies 74 may be coupled to the substrate 70 by wire bonds orconductive bumps. In an embodiment, the dies 74 are stacked memory dies.For example, the stacked memory dies 74 may include low-power (LP)double data rate (DDR) memory modules, such as LPDDR1, LPDDR2, LPDDR3,LPDDR4, or the like memory modules.

In some embodiments, the dies 308 and the wire bonds (if present) may beencapsulated by a molding material 76. The molding material 76 may bemolded on the dies 74, for example, using compression molding. In someembodiments, the molding material 76 is a molding compound, a polymer,an epoxy, silicon oxide filler material, the like, or a combinationthereof. A curing step may be performed to cure the molding material 76,wherein the curing may be a thermal curing, a UV curing, the like, or acombination thereof.

In some embodiments, the dies 74 and the wire bonds (if present) areburied in the molding material 76, and after the curing of the moldingmaterial 76, a planarization step, such as a grinding, is performed toremove excess portions of the molding material 76 and provide asubstantially planar surface for the second packages 110.

After the second packages 110 are formed, the second packages 110 arebonded to the first packages 100 by way of conductive connectors 78, thebond pads 71, and the metallization pattern 64.

The conductive connectors 78 may be BGA connectors, solder balls, metalpillars, controlled collapse chip connection (C4) bumps, micro bumps,electroless nickel-electroless palladium-immersion gold technique(ENEPIG) formed bumps, or the like. The conductive connectors 78 mayinclude a conductive material such as solder, copper, aluminum, gold,nickel, silver, palladium, tin, the like, or a combination thereof. Insome embodiments, the conductive connectors 78 are formed by initiallyforming a layer of solder through such commonly used methods such asevaporation, electroplating, printing, solder transfer, ball placement,or the like. Once a layer of solder has been formed on the structure, areflow may be performed in order to shape the material into the desiredbump shapes. In another embodiment, the conductive connectors 78 aremetal pillars (such as a copper pillar) formed by a sputtering,printing, electro plating, electroless plating, CVD, or the like. Themetal pillars may be solder free and have substantially verticalsidewalls. In some embodiments, a metal cap layer (not shown) is formedon the top of the metal pillar connectors 78. The metal cap layer mayinclude nickel, tin, tin-lead, gold, silver, palladium, indium,nickel-palladium-gold, nickel-gold, the like, or a combination thereofand may be formed by a plating process.

In some embodiments, before bonding the conductive connectors 78, theconductive connectors 78 are coated with a flux (not shown), such as ano-clean flux. The conductive connectors 78 may be dipped in the flux orthe flux may be jetted onto the conductive connectors 78. In anotherembodiment, the flux may be applied to the surfaces of the metallizationpatterns 64.

In some embodiments, the conductive connectors 78 may have an epoxy flux(not shown) formed thereon before they are reflowed with at least someof the epoxy portion of the epoxy flux remaining after the secondpackage 110 is attached to the first package 100. This remaining epoxyportion may act as an underfill to reduce stress and protect the jointsresulting from the reflowing the conductive connectors 78. In someembodiments, an underfill 80 may be formed between the second package110 and the first package 100 and surrounding the conductive connectors78. The underfill may be formed by a capillary flow process after thesecond package 110 is attached or may be formed by a suitable depositionmethod before the second package 110 is attached.

The bonding between the second package 110 and the first package 100 maybe a solder bonding or a direct metal-to-metal (such as acopper-to-copper or tin-to-tin) bonding. In an embodiment, the secondpackage 110 is bonded to the first package 200 by a reflow process.During this reflow process, the conductive connectors 78 are in contactwith the bond pads 71 and the metallization patterns 64 to physicallyand electrically couple the second package 110 to the first package 100.After the bonding process, an IMC (not shown) may form at the interfaceof the metallization patterns 64 and the conductive connectors 78 andalso at the interface between the conductive connectors 78 and the bondpads 71.

In FIG. 11, the structure including one or more first packages 100 andone or more second packages 110 is flipped over and placed on a tape 82.Further, the wafer 20 can undergo a grinding process to expose thethrough vias 24. Surfaces of the through vias 24 and wafer 20 arecoplanar after the grinding process. In some embodiments, the grindingmay be omitted, for example, if through vias 24 are already exposedthrough the wafer 20.

After the through vias 24 are exposed, pads 84 and conductive connectors86 are formed over the through vias 24. The pads 84 are formed onexposed surfaces of the through vias 24. The pads 84 are used to coupleto conductive connectors 86 and may be referred to as under bumpmetallurgies (UBMs) 84. As an example to form the pads 84, a seed layer(not shown) is formed over the surface of the wafer 20. In someembodiments, the seed layer is a metal layer, which may be a singlelayer or a composite layer comprising a plurality of sub-layers formedof different materials. In some embodiments, the seed layer comprises atitanium layer and a copper layer over the titanium layer. The seedlayer may be formed using, for example, PVD or the like. A photo resistis then formed and patterned on the seed layer. The photo resist may beformed by spin coating or the like and may be exposed to light forpatterning. The pattern of the photo resist corresponds to the pads 84.The patterning forms openings through the photo resist to expose theseed layer. A conductive material is formed in the openings of the photoresist and on the exposed portions of the seed layer. The conductivematerial may be formed by plating, such as electroplating or electrolessplating, or the like. The conductive material may comprise a metal, likecopper, titanium, tungsten, aluminum, or the like. Then, the photoresist and portions of the seed layer on which the conductive materialis not formed are removed. The photo resist may be removed by anacceptable ashing or stripping process, such as using an oxygen plasmaor the like. Once the photo resist is removed, exposed portions of theseed layer are removed, such as by using an acceptable etching process,such as by wet or dry etching. The remaining portions of the seed layerand conductive material form the pads 84. In the embodiment, where thepads 84 are formed differently, more photo resist and patterning stepsmay be utilized.

The conductive connectors 86 are formed on the UBMs 84. The conductiveconnectors 86 may be BGA connectors, solder balls, metal pillars, C4bumps, micro bumps, ENEPIG formed bumps, or the like. The conductiveconnectors 86 may include a conductive material such as solder, copper,aluminum, gold, nickel, silver, palladium, tin, the like, or acombination thereof. In some embodiments, the conductive connectors 86are formed by initially forming a layer of solder through such commonlyused methods such as evaporation, electroplating, printing, soldertransfer, ball placement, or the like. Once a layer of solder has beenformed on the structure, a reflow may be performed in order to shape thematerial into the desired bump shapes. In another embodiment, theconductive connectors 86 are metal pillars (such as a copper pillar)formed by a sputtering, printing, electro plating, electroless plating,CVD, or the like. The metal pillars may be solder free and havesubstantially vertical sidewalls. In some embodiments, a metal cap layer(not shown) is formed on the top of the metal pillar connectors 86. Themetal cap layer may include nickel, tin, tin-lead, gold, silver,palladium, indium, nickel-palladium-gold, nickel-gold, the like, or acombination thereof and may be formed by a plating process.

In FIG. 12, the structure including one or more first packages 100 andone or more second packages 110 is flipped over and placed on a tape 88.Further, a singulation process is performed by sawing 90 along scribeline regions e.g., between second packages 110 and first packages 100.

FIG. 13 illustrates a resulting, singulated package, which includes afirst package 100 and a second package 110. Further, package includingthe packages 100 and 110 may be mounted to a substrate 112. Thesubstrate 112 may be referred to a package substrate 112. The package100 is mounted to the package substrate 400 using the conductiveconnectors 86.

The package substrate 112 may be made of a semiconductor material suchas silicon, germanium, diamond, or the like. Alternatively, compoundmaterials such as silicon germanium, silicon carbide, gallium arsenic,indium arsenide, indium phosphide, silicon germanium carbide, galliumarsenic phosphide, gallium indium phosphide, combinations of these, andthe like, may also be used. Additionally, the package substrate 112 maybe a SOI substrate. Generally, an SOI substrate includes a layer of asemiconductor material such as epitaxial silicon, germanium, silicongermanium, SOI, SGOI, or combinations thereof. The package substrate 112is, in one alternative embodiment, based on an insulating core such as afiberglass reinforced resin core. One example core material isfiberglass resin such as FR4. Alternatives for the core material includebismaleimide-triazine BT resin, or alternatively, other PCB materials orfilms. Build up films such as ABF or other laminates may be used forpackage substrate 112.

The package substrate 1112 may include active and passive devices (notshown). As one of ordinary skill in the art will recognize, a widevariety of devices such as transistors, capacitors, resistors,combinations of these, and the like may be used to generate thestructural and functional requirements of the design for thesemiconductor package. The devices may be formed using any suitablemethods.

The package substrate 112 may also include metallization layers and viasand bond pads (not shown) over the metallization layers and vias. Themetallization layers may be formed over the active and passive devicesand are designed to connect the various devices to form functionalcircuitry. The metallization layers may be formed of alternating layersof dielectric (e.g., low-k dielectric material) and conductive material(e.g., copper) with vias interconnecting the layers of conductivematerial and may be formed through any suitable process (such asdeposition, damascene, dual damascene, or the like). In someembodiments, the package substrate 112 is substantially free of activeand passive devices.

In some embodiments, the conductive connectors 86 can be reflowed toattach the packages 100 and 110 to the substrate 112. The conductiveconnectors 86 electrically and/or physically couple the substrate 112,including metallization layers in the substrate 112, to the firstpackage 100.

The conductive connectors 86 may have an epoxy flux (not shown) formedthereon before they are reflowed with at least some of the epoxy portionof the epoxy flux remaining after the packages 110 and 100 are attachedto the substrate 112. This remaining epoxy portion may act as anunderfill to reduce stress and protect the joints resulting from thereflowing the conductive connectors 86. In some embodiments, anunderfill (not shown) may be formed between the first package 100 andthe substrate 112 and surrounding the conductive connectors 86. Theunderfill may be formed by a capillary flow process after the packages110 and 100 are attached or may be formed by a suitable depositionmethod before the packages 110 and 100 are attached.

FIG. 14 illustrates a cross-sectional view of a package structureincluding openings through a wafer in accordance with some embodiments.This embodiment is similar to the previous embodiment of FIGS. 1 through13 except that in this embodiment, the wafer 20 has openings formedthrough it with electrical connectors 114 formed in the openings insteadof the through vias 24. Details regarding this embodiment that aresimilar to those for the previously described embodiment will not berepeated herein.

In FIG. 14, the wafer 20 may have openings formed through it to allowfor the conductive connectors 86 to be electrically coupled to thefront-side redistribution structure 28. The openings may be formedthrough the wafer 20 by, for example, using laser drilling, etching, orthe like. The openings may be formed just before the conductiveconnectors 86 are formed (see, e.g., FIG. 11 of previous embodiment) ormay be formed earlier in the process.

The electrical connectors 114 may be formed in the openings through thewafer 20 while the structure is flipped over on a tape similar to thatshown in FIG. 11. As an example to form electrical connectors 114, aseed layer (not shown) is formed over the wafer 20 and in the openings.In some embodiments, the seed layer is a metal layer, which may be asingle layer or a composite layer comprising a plurality of sub-layersformed of different materials. In some embodiments, the seed layercomprises a titanium layer and a copper layer over the titanium layer.The seed layer may be formed using, for example, PVD or the like. Aphoto resist is then formed and patterned on the seed layer. The photoresist may be formed by spin coating or the like and may be exposed tolight for patterning. The pattern of the photo resist corresponds to theelectrical connectors 114. The patterning forms openings through thephoto resist to expose the seed layer. A conductive material is formedin the openings of the photo resist and on the exposed portions of theseed layer. The conductive material may be formed by plating, such aselectroplating or electroless plating, or the like. The conductivematerial may comprise a metal, like copper, titanium, tungsten,aluminum, or the like. Then, the photo resist and portions of the seedlayer on which the conductive material is not formed are removed. Thephoto resist may be removed by an acceptable ashing or strippingprocess, such as using an oxygen plasma or the like. Once the photoresist is removed, exposed portions of the seed layer are removed, suchas by using an acceptable etching process, such as by wet or dryetching. The remaining portions of the seed layer and conductivematerial form the electrical connectors 114.

After the electrical connectors 114 are formed, the conductiveconnectors 86 may be formed on the electrical connectors 114. In someembodiments, there are UBMs between the conductive connectors 86 and theelectrical connectors 114.

FIG. 15 illustrates a cross-sectional view of a package structureincluding a single integrated circuit die 42 in accordance with someembodiments. This embodiment is similar to the previous embodiment ofFIGS. 1 through 13 except that in this embodiment, the package structureincludes a single integrated circuit die 42 instead of multipleintegrated circuit dies 42. Details regarding this embodiment that aresimilar to those for the previously described embodiment will not berepeated herein.

FIGS. 16 through 23 illustrate cross-sectional views of intermediatesteps during a process for forming a package structure in accordancewith some embodiments. This embodiment is similar to the previousembodiment of FIG. 15 except that in this embodiment, the first package110 has been replaced with an integrated fan-out (InFO) packagestructure 160. Details regarding this embodiment that are similar tothose for the previously described embodiment will not be repeatedherein.

FIGS. 16 through 23 illustrate cross-sectional views of intermediatesteps of forming the first package 160 over the second package 130 ofFIG. 15. In these Figures only one first package 160 is illustrated butmultiple first packages 160 may be formed simultaneously over multiplesecond packages 160 and then the structure may be singulated to formmultiple package structures. FIG. 16 illustrates openings in theredistribution structure 60 to expose portions of the metallizationpattern 64.

In FIG. 17, through vias 136 are formed. As an example to form thethrough vias 136, a seed layer is formed over the redistributionstructure 60 an in the openings. In some embodiments, the seed layer isa metal layer, which may be a single layer or a composite layercomprising a plurality of sub-layers formed of different materials. Insome embodiments, the seed layer comprises a titanium layer and a copperlayer over the titanium layer. The seed layer may be formed using, forexample, PVD or the like. A photo resist is formed and patterned on theseed layer. The photo resist may be formed by spin coating or the likeand may be exposed to light for patterning. The pattern of the photoresist corresponds to through vias. The patterning forms openingsthrough the photo resist to expose the seed layer. A conductive materialis formed in the openings of the photo resist and on the exposedportions of the seed layer. The conductive material may be formed byplating, such as electroplating or electroless plating, or the like. Theconductive material may comprise a metal, like copper, titanium,tungsten, aluminum, or the like. The photo resist and portions of theseed layer on which the conductive material is not formed are removed.The photo resist may be removed by an acceptable ashing or strippingprocess, such as using an oxygen plasma or the like. Once the photoresist is removed, exposed portions of the seed layer are removed, suchas by using an acceptable etching process, such as by wet or dryetching. The remaining portions of the seed layer and conductivematerial form through vias 136.

In FIG. 18, integrated circuit dies 138 are attached to theredistribution structure 60 by an adhesive (not shown). As illustratedin FIG. 18, two integrated circuit dies 138 are attached, and in otherembodiments, more or less integrated circuit dies 138 may be attachedfor each package structure. The integrated circuit dies 138 may be logicdies (e.g., central processing unit, microcontroller, etc.), memory dies(e.g., DRAM die, SRAM die, etc.), power management dies (e.g., PMICdie), RF dies, sensor dies, MEMS dies, signal processing dies (e.g., DSPdie), front-end dies (e.g., AFE dies), the like, or a combinationthereof. Also, in some embodiments, the integrated circuit dies 138 maybe different sizes (e.g., different heights and/or surface areas), andin other embodiments, the integrated circuit dies 138 may be the samesize (e.g., same heights and/or surface areas).

Before being adhered, the integrated circuit dies 138 may be processedaccording to applicable manufacturing processes to form integratedcircuits in the integrated circuit dies 138. For example, the integratedcircuit dies 138 each include a semiconductor substrate 139, such assilicon, doped or undoped, or an active layer of asemiconductor-on-insulator (SOI) substrate. The semiconductor substrate139 may include other semiconductor material, such as germanium; acompound semiconductor including silicon carbide, gallium arsenic,gallium phosphide, indium phosphide, indium arsenide, and/or indiumantimonide; an alloy semiconductor including SiGe, GaAsP, AlInAs,AlGaAs, GaInAs, GaInP, and/or GaInAsP; or combinations thereof. Othersubstrates, such as multi-layered or gradient substrates, may also beused. Devices, such as transistors, diodes, capacitors, resistors, etc.,may be formed in and/or on the semiconductor substrate 139 and may beinterconnected by interconnect structures 120 formed by, for example,metallization patterns in one or more dielectric layers on thesemiconductor substrate 139 to form an integrated circuit.

The integrated circuit dies 138 further comprise pads, such as aluminumpads, to which external connections are made. The pads are on what maybe referred to as respective active sides of the integrated circuit dies138. Die connectors 142, such as conductive pillars (for example,comprising a metal such as copper), are mechanically and electricallycoupled to the respective pads. The die connectors 142 may be formed by,for example, plating, or the like. The die connectors 142 electricallycouple the respective integrated circuits of the integrate circuit dies138.

A dielectric material 144 is on the active sides of the integratedcircuit dies 138, such as on the die connectors 142. The dielectricmaterial 144 laterally encapsulates the die connectors 142, and thedielectric material 144 is laterally coterminous with the respectiveintegrated circuit dies 138. The dielectric material 144 may be apolymer such as PBO, polyimide, BCB, or the like; a nitride such assilicon nitride or the like; an oxide such as silicon oxide, PSG, BSG,BPSG, or the like; the like, or a combination thereof, and may beformed, for example, by spin coating, lamination, CVD, or the like.

The adhesive layer (not shown) may be on back sides of the integratedcircuit dies 138 and adheres the integrated circuit dies 138 to thefirst package 130. The adhesive may be any suitable adhesive, epoxy, dieattach film (DAF), or the like. The adhesive may be applied to a backside of the integrated circuit dies 138, such as to a back-side of therespective semiconductor wafer or may be applied over the surface of thefirst package 130. The integrated circuit dies 138 may be singulated,such as by sawing or dicing, and adhered to the first package 130 by theadhesive using, for example, a pick-and-place tool.

In FIG. 19, an encapsulant 146 is formed on the various components. Theencapsulant 146 may be a molding compound, epoxy, or the like, and maybe applied by compression molding, transfer molding, or the like.

In FIG. 20, after curing, the encapsulant 146 can undergo a grindingprocess to expose the through vias 136 and die connectors 142. Topsurfaces of the through vias 136, die connectors 142, and encapsulant146 are coplanar after the grinding process. In some embodiments, thegrinding may be omitted, for example, if through vias 136 and dieconnectors 142 are already exposed.

In FIG. 21, a front-side redistribution structure 148 is formed. Asillustrated in FIG. 21, the front-side redistribution structure 148includes dielectric layers 152, and metallization patterns 150 that arecoupled to the through vias 136 and the die connectors 142. Theredistribution structure 148 may be formed similar to the redistributionstructure 60 described above and the description is not repeated herein.After the formation of the redistribution structure 148, the secondpackage 160 is formed.

The front-side redistribution structure 148 is shown as an example. Moreor fewer dielectric layers and metallization patterns may be formed inthe front-side redistribution structure 148. If fewer dielectric layersand metallization patterns are to be formed, steps and process discussedabove may be omitted. If more dielectric layers and metallizationpatterns are to be formed, steps and processes discussed above may berepeated. One having ordinary skill in the art will readily understandwhich steps and processes would be omitted or repeated.

In FIG. 22, the structure including one or more first packages 130 andone or more second packages 160 is flipped over and placed on a tape162. Further, the wafer 20 can undergo a grinding process to expose thethrough vias 24. Surfaces of the through vias 24 and wafer 20 arecoplanar after the grinding process. In some embodiments, the grindingmay be omitted, for example, if through vias 24 are already exposedthrough the wafer 20. After the through vias 24 are exposed, pads (notshown) and conductive connectors 86 are formed over the through vias 24.

In some embodiments, the structure including one or more first packages130 and one or more second packages 160 is flipped over and placed on atape for a singulation process.

FIG. 23 illustrates a resulting, singulated package, which includes afirst package 130 and a second package 160. Further, the packageincluding the packages 130 and 160 may be mounted to a substrate 112.The substrate 112 may be referred to a package substrate 112. Thepackage 100 is mounted to the package substrate 400 using the conductiveconnectors 86.

Embodiments discussed herein may achieve advantages. In particular, thedisclosed embodiments include an integrated fan-out design that enablesmore functionality and reliability. The package structures may include achip/die that is hybrid bonded to a wafer structure with the waferstructure including one or more integrated passive devices (IPDs). Someof disclosed methods of forming the package structure includeoptimization of the method that does not require as many carriersubstrates (or, in some cases, no carrier substrates) as other methods.Further, the hybrid bonding process allows for the bond between thechip/die and the wafer to not include a solder material, and thus, mayincrease the reliability and yield of package structures.

An embodiment is a method including forming a first passive device in afirst wafer, forming a first dielectric layer over a first side of thefirst wafer, forming a first plurality of bond pads in the firstdielectric layer, planarizing the first dielectric layer and the firstplurality of bond pads to level top surfaces of the first dielectriclayer and the first plurality of bond pads with each other, hybridbonding a first device die to the first dielectric layer and at leastsome of the first plurality of bond pads, and encapsulating the firstdevice die in a first encapsulant.

Another embodiment is a method including forming a first packageincluding forming a passive device and a through via in a first wafer,forming a first redistribution structure over a first side of the firstwafer, the first redistribution structure including a first plurality ofbond pads in a first dielectric layer, top surfaces of the firstplurality of bond pads substantially coplanar with a top surface of thefirst dielectric layer, forming a first electrical connector on one ofthe first plurality of bond pads, bonding a first device die to thefirst redistribution structure, a dielectric layer of the first devicedie being bonded to the first dielectric layer, and metal pads in thefirst device die being bonded to the first plurality of bond padsthrough metal-to-metal bonding, and encapsulating the first device diein a first molding compound.

A further embodiment is a structure including a first wafer including afirst passive device and a first through via, the first passive devicebeing embedded in the first wafer, the first through via extendingthrough the first wafer, a first redistribution structure on a firstside of the first wafer, the first redistribution structure including aplurality of metallization patterns comprising a first plurality of bondpads, and a first plurality of dielectric layers, with the plurality ofmetallization patterns located in the first plurality of dielectriclayers, and the first plurality of dielectric layers comprises a firstdielectric layer, with a first surface of the first dielectric layerbeing substantially coplanar with first surfaces of the first pluralityof bond pads, and a device die including a second plurality of bond padsbonded to the first plurality of bond pads through metal-to-metalbonding, and a second plurality of dielectric layers including a seconddielectric layer, with the second dielectric layer having a secondsurface substantially coplanar with second surfaces of the secondplurality bond pads, wherein the first dielectric layer is bonded to thesecond dielectric layer through dielectric-to-dielectric bonds.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A structure comprising: a substrate comprising apassive device; a first redistribution structure on the substrate, thefirst redistribution structure comprising a first bond pad and a firstdielectric layer around the first bond pad; a first integrated circuitdie comprising a second bond pad and a second dielectric layer aroundthe second bond pad, the first dielectric layer and the seconddielectric layer bonded through dielectric-to-dielectric bonds, thefirst bond pad and the second bond pad bonded through metal-to-metalbonds, the first dielectric layer extending laterally beyond outermostlateral sidewalls of the second dielectric layer; a first encapsulantsurrounding the first integrated circuit die; and a secondredistribution structure on the first encapsulant, a portion of thefirst encapsulant being disposed between the second redistributionstructure and the first integrated circuit die.
 2. The structure ofclaim 1 further comprising: a conductive via extending through the firstencapsulant, the conductive via connecting the first redistributionstructure to the second redistribution structure.
 3. The structure ofclaim 2, wherein the first redistribution structure further comprises ametallization pattern, the metallization pattern comprising the firstbond pad and a third bond pad, the conductive via contacting the thirdbond pad, the metallization pattern connected to the first integratedcircuit die, the passive device, and the conductive via.
 4. Thestructure of claim 3, wherein the first redistribution structure isdisposed on a first surface of the substrate, further comprising: a paddisposed on a second surface of the substrate; and a conductive featureextending from the first surface of the substrate to the second surfaceof the substrate, the conductive feature connecting the pad to themetallization pattern.
 5. The structure of claim 1 further comprising: amemory package bonded to the second redistribution structure.
 6. Thestructure of claim 1 further comprising: a second integrated circuit diebonded to the second redistribution structure; a second encapsulantsurrounding the second integrated circuit die; a third redistributionstructure on the second encapsulant; and a conductive via extendingthrough the second encapsulant, the conductive via connecting the secondredistribution structure to the third redistribution structure.
 7. Thestructure of claim 6, wherein an active surface of the second integratedcircuit die faces away from an active surface of the first integratedcircuit die.
 8. A structure comprising: a first device comprising apassive device, a first metallization pattern, and a first dielectriclayer, the first metallization pattern connected to the passive device;a second device comprising an active device, a second metallizationpattern, and a second dielectric layer, the second metallization patternconnected to the active device, the second device being bonded to thefirst device by covalent bonds between a first material of the firstdielectric layer and a second material of the second dielectric layer; afirst encapsulant contacting sidewalls of the second dielectric layer,the first encapsulant being laterally coterminous with the firstdielectric layer; and a first conductive via extending through the firstencapsulant, the first metallization pattern connected to the firstconductive via and the second metallization pattern.
 9. The structure ofclaim 8 further comprising: a first redistribution structure contactingthe first encapsulant, the first redistribution structure comprising athird dielectric layer and a third metallization pattern, the firstconductive via connected to the third metallization pattern.
 10. Thestructure of claim 9, wherein a portion of the first encapsulant isdisposed between the third dielectric layer and the second device. 11.The structure of claim 9 further comprising: a third device comprising areflowable connector, the reflowable connector connected to the thirdmetallization pattern.
 12. The structure of claim 9 further comprising:a third device adhered to the third dielectric layer, the third devicecomprising a fourth metallization pattern and a fourth dielectric layer;a second encapsulant contacting sidewalls of the fourth dielectriclayer; a second conductive via extending through the second encapsulant;and a second redistribution structure contacting the second encapsulantand the fourth dielectric layer, the second redistribution structurecomprising a fifth dielectric layer and a fifth metallization pattern,the fifth metallization pattern connected to the second conductive viaand the fourth metallization pattern, the second encapsulant beinglaterally coterminous with the third dielectric layer and the fifthdielectric layer.
 13. The structure of claim 8, wherein the first devicefurther comprises: a substrate comprising the passive device, the firstdielectric layer disposed adjacent a first surface of the substrate; anda conductive feature extending from the first surface of the substrateto a second surface of the substrate, the conductive feature connectedto the first metallization pattern.
 14. The structure of claim 13,wherein a surface of the conductive feature is planar with the secondsurface of the substrate, further comprising: a pad contacting thesecond surface of the substrate, the pad connected to the conductivefeature; and a reflowable connector contacting the pad.
 15. Thestructure of claim 13, wherein the conductive feature has a firstportion and a second portion, the first portion extending through thesubstrate, the second portion extending along the second surface of thesubstrate, further comprising: a reflowable connector contacting thesecond portion of the conductive feature.
 16. A structure comprising: afirst substrate comprising a passive device; a first conductive viaextending from a first side of the first substrate to a second side ofthe first substrate; a first dielectric layer at the first side of thefirst substrate; a first metallization pattern in the first dielectriclayer, the first metallization pattern connected to the passive deviceand the first conductive via, the first metallization pattern comprisinga first bond pad; a second substrate comprising an active device; asecond dielectric layer at a third side of the second substrate, thesecond dielectric layer and the first dielectric layer bonded throughdielectric-to-dielectric bonds; a second metallization pattern in thesecond dielectric layer, the second metallization pattern connected tothe active device, the second metallization pattern comprising a secondbond pad, the second bond pad and the first bond pad bonded throughmetal-to-metal bonds; and a first encapsulant contacting sidewalls ofthe second substrate and the second dielectric layer, the firstencapsulant being laterally coterminous with the first substrate and thefirst dielectric layer.
 17. The structure of claim 16 furthercomprising: a redistribution structure contacting the first encapsulant;and a second conductive via extending through the first encapsulant, thesecond conductive via connected to the redistribution structure and thefirst metallization pattern.
 18. The structure of claim 16, wherein aportion of the first encapsulant contacts a fourth side of the secondsubstrate.
 19. The structure of claim 16, wherein a first width of thefirst dielectric layer is greater than a second width of the seconddielectric layer.
 20. The structure of claim 16 further comprising: aconductive connector at the second side of the first substrate, theconductive connector connected to the first conductive via; and apackage substrate connected to the conductive connector.